发明名称 CONDUCTIVE PASTE FOR MULTILAYER WIRING BOARD
摘要 PURPOSE: To provide a conductive paste for a via-conductor which can suppress the occurrence of inner pores or cracks while suppressing the resistance value of the via-conductor low. CONSTITUTION: This conductive paste which forms a conductor (via-conductor), being charged in the through hole of a glass ceramic board sintered at a low temperature, contains matter A consisting of metal and matter B consisting of conductive metallic oxides as its main components. It is arranged so that the relation of T1 <T<T2 may be fulfilled when defined that the sintering temperature of the matter A is T1 , the sintering temperature of the matter B is T2 , and the sintering temperature of glass ceramic material is T.
申请公布号 JPH08242049(A) 申请公布日期 1996.09.17
申请号 JP19950043759 申请日期 1995.03.03
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 NISHIKAWA EISHIN;IWAKI TAKAHIKO;TSURUMI KOICHI;KUMAGAI KOICHI
分类号 H05K1/09;H05K3/40;H05K3/46;(IPC1-7):H05K1/09 主分类号 H05K1/09
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