发明名称 |
CONDUCTIVE PASTE FOR MULTILAYER WIRING BOARD |
摘要 |
PURPOSE: To provide a conductive paste for a via-conductor which can suppress the occurrence of inner pores or cracks while suppressing the resistance value of the via-conductor low. CONSTITUTION: This conductive paste which forms a conductor (via-conductor), being charged in the through hole of a glass ceramic board sintered at a low temperature, contains matter A consisting of metal and matter B consisting of conductive metallic oxides as its main components. It is arranged so that the relation of T1 <T<T2 may be fulfilled when defined that the sintering temperature of the matter A is T1 , the sintering temperature of the matter B is T2 , and the sintering temperature of glass ceramic material is T. |
申请公布号 |
JPH08242049(A) |
申请公布日期 |
1996.09.17 |
申请号 |
JP19950043759 |
申请日期 |
1995.03.03 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NISHIKAWA EISHIN;IWAKI TAKAHIKO;TSURUMI KOICHI;KUMAGAI KOICHI |
分类号 |
H05K1/09;H05K3/40;H05K3/46;(IPC1-7):H05K1/09 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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