发明名称 MOLD APPARATUS
摘要 PURPOSE: To mold a resin tablet without generating the deformation of a lead frame caused by the resin powder falling from a holding mechanism for holding the resin tablet at the time of feed in a mold apparatus feeding the resin tablet of a molding material to a mold to mold the same. CONSTITUTION: A cleaning means for automatically removing the resin powder 14 bonded to the holding part 11 of a holding mechanism is provided. This cleaning means removes the resin powder 14 by a suction hose 12, air blow, a brush or a combination of them.
申请公布号 JPH08238644(A) 申请公布日期 1996.09.17
申请号 JP19950043801 申请日期 1995.03.03
申请人 TOSHIBA FA SYST ENG KK;TOSHIBA CORP 发明人 SATO HIROSHI;MINAMI TAKEHIRO
分类号 B29C31/04;B29C45/02;B29C45/18;B29L31/34;(IPC1-7):B29C45/02 主分类号 B29C31/04
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