发明名称 |
MOLD APPARATUS |
摘要 |
PURPOSE: To mold a resin tablet without generating the deformation of a lead frame caused by the resin powder falling from a holding mechanism for holding the resin tablet at the time of feed in a mold apparatus feeding the resin tablet of a molding material to a mold to mold the same. CONSTITUTION: A cleaning means for automatically removing the resin powder 14 bonded to the holding part 11 of a holding mechanism is provided. This cleaning means removes the resin powder 14 by a suction hose 12, air blow, a brush or a combination of them. |
申请公布号 |
JPH08238644(A) |
申请公布日期 |
1996.09.17 |
申请号 |
JP19950043801 |
申请日期 |
1995.03.03 |
申请人 |
TOSHIBA FA SYST ENG KK;TOSHIBA CORP |
发明人 |
SATO HIROSHI;MINAMI TAKEHIRO |
分类号 |
B29C31/04;B29C45/02;B29C45/18;B29L31/34;(IPC1-7):B29C45/02 |
主分类号 |
B29C31/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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