发明名称 Polar bond head
摘要 A polar motion bond head for bonding semiconductor devices includes voice coil motors for providing positioning motion to the bond head, and a vision system that has an optical path that allows the camera to see all polar positions with the image staying on the camera centerline.
申请公布号 US5556022(A) 申请公布日期 1996.09.17
申请号 US19940254225 申请日期 1994.06.06
申请人 TEXAS INSTRUMENTS INCORPORATED 发明人 ORCUTT, JOHN W.;LIN, GALLE
分类号 H01L21/60;B23K20/00;(IPC1-7):B23K1/06 主分类号 H01L21/60
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