| 摘要 |
PURPOSE: To obtain a molded semiconductor device in which the solder can be prevented from adhering to the surface of a pellet when the pellet is fixed to an island part of a lead frame. CONSTITUTION: The molded semiconductor device comprises a lead frame (island part) 1 obtained by machining a metal plate into a predetermined shape, a lead frame (electrode part) 2, a pellet 3, thin gold wires 4a, 4b, a pellet body, a glass protective film, grooves 8a, 8b, and a fixing plate 9, wherein a solder 7 is placed in the grooves 8a, 8b at the pellet mount part of the lead frame (island part) 1. The groove 8a of about 100μm deep is made in the pellet mount part of the lead frame (island part) 1 and the groove of 20-50μm deep is made contiguously to the groove 8a at the pellet mount part such that the solder 7 does no creep up the pellet 3 to cause trouble in the electric wiring of the thin gold wires 4a, 4b. |
