发明名称 COPPER PASTE FOR CERAMIC MULTILAYER WIRING BOARD
摘要 PURPOSE: To obtain a ceramic multilayer wiring board by the use of copper conductors as wiring materials wherein the resistance values of wiring conductors are low and adhesive force between a glass ceramic and the copper conductors is excellent. CONSTITUTION: Zirconium and hafnium are added to copper paste. Zirconium and hafnium form stable oxides easily in a sintering process, and the oxides strengthen the bond between oxides of copper and a glass ceramic. Accordingly, such a constitution makes it possible to obtain a ceramic multilayer wiring board wherein the resistance values of wiring conductors are low and the adhesive force between the glass ceramic and copper conductors are excellent. Consequently, it becomes possible to obtain a ceramic multilayer wiring board wherein the resistance values of wiring conductors are low and adhesive force between the glass ceramic and copper conductors is excellent.
申请公布号 JPH08236887(A) 申请公布日期 1996.09.13
申请号 JP19950033328 申请日期 1995.02.22
申请人 HITACHI LTD 发明人 FUJII MITSURU;SEKIHASHI MASAO
分类号 H05K1/09;H05K3/46;(IPC1-7):H05K1/09 主分类号 H05K1/09
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