HYBRID INTEGRATED CIRCUIT DEVICE AND ITS MANUFACTURE

摘要

PURPOSE: To provide a hybrid integrated circuit device having a package whose main body is a substrate having improved shield effect against radiation noise and a manufacturing method thereof. CONSTITUTION: A recessed part 11 is formed from a surface of a substrate 1 formed of an insulating material such as glass epoxy. A surface conductor layer 7 is formed on a surface of a substrate enclosing the recessed part 11. A rear conductor layer 9 is formed on a rear of the substrate. A circuit element 14 is mounted inside the recessed part 11. A side plating film 13 connected to the surface conductor layer 7 and the rear conductor layer 9 is formed enclosing the outside of the recessed part 11 completely. A side surface of a substrate has a cutting part which is separated to each substrate and has a surface shaving processing groove 6 reaching an inner conductor layer 8 from a surface and a rear shaving processing groove 4 reaching the inner conductor layer 8 from a rear in the cutting part. A side plating film 13 is formed in a side wall of the surface shaving processing groove 6 and a side wall of the rear shaving processing groove 4. A cutting surface 10 is provided to a position of a substrate outside the rear shaving processing groove 4.