发明名称 ELECTRICAL AND THERMAL INTERCONNECTION SYSTEM FOR ELECTRONIC CIRCUIT BOARDS AND AN ELECTRICAL CABINET FITTED WITH SUCH A SYSTEM
摘要 <p>AN ELECTRICAL AND THERMAL INTERCONNECTION SYSTEM FOR ELECTRONIC CIRCUIT BOARDS AND AN ELECTRICAL CABINET FITTED WITH SUCH A SYSTEM An interconnection system, both electrical and thermal, allowing improved evacuation of the thermal dissipation of printed-circuit boards. It comprises zero insertion force electrical and thermal connectors such as (67) and (69) of the plug-in type, which are applied by their metallic bases to one of the metallic layers of the mother boards (60) and (61), and other connectors of the same type, such as (68) and (70), which are applied by their bases to the other external layer of these mother boards (60) and (61). The mother boards are inclined, sloping downwards from the front panel or door (63) to the rear part (64) of a cabinet. Application : racks and cabinets for electrical and telecommunication equipment. Figure 4</p>
申请公布号 CA1157932(A) 申请公布日期 1983.11.29
申请号 CA19810372372 申请日期 1981.03.05
申请人 SOCAPEX 发明人 VILLEMANT, CLAUDE M.;BRICAUD, HENRI;HAMAIDE, PIERRE
分类号 H01R12/71;H05K1/02;H05K3/00;H05K3/36;H05K7/14;(IPC1-7):H05K1/14 主分类号 H01R12/71
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