METAL PACKAGE WITH HIGH FREQUENCY TERMINAL

摘要

PURPOSE: To facilitate assembling work of high frequency terminals and a metal package having the high frequency terminals while suppressing the loss caused by fluctuation of machining. CONSTITUTION: A semiconductor element can by mounted on a base 1 and a frame body 13 and a board 11 are fixed to face the side face of the semiconductor element through a predetermined distance. A high frequency terminal 10, comprising the base 1, a conductor 3 and a chip 5, penetrates the frame body 13. Major surface of the base 1 projects from the inner side face at one end thereof and from the outer side face at the other end thereof. The conductor 3 extends from one end of the major surface to the other end thereof. The chip 5 is formed in the center of the conductor 3. The base 1 and the chip 5 comprises a porous ceramics having dielectric constant of 3.5 or less.