| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the plating process to simplify the flip chip connection to a substrate by stenciling a precursor substance on bond pads so that bumps form conductive interconnections. SOLUTION: This method is provided with a first layer 22 of conductive polymerizable precursor substance selectively formed on bond pads 12, 14 with an org. protective layer 18 acting as a template for determining deposit regions of the first layer 22 of a monomer on a flip chip 10, placing bumps 28, 30 on the chip 10 at known arranged positions of the bond pads 32, 34 on a substrate 36, contacting the bond pads 32, 34 to bumps 28, 30, and heating to polymerize the bumps, thereby electrically connecting the pads 12, 14 on the flip chip to the bond pads of the substrate. |
