| 摘要 |
A method is disclosed for grinding and polishing a substrate (20). An abrasive slurry (26) is applied to the surface (22) of the substrate (20). A lap (28) is moved across, and in engagement with, the surface of the substrate (20) in the medium of the abrasive slurry (26). Ultrasonic energy is mechanically applied to the surface (24) of the substrate such that half wave resonance occurs substantially at the surface (22) of the substrate (20). In this manner, a thickness of material is removed at an enhanced rate from the surface (22) of the substrate (20).
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