SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PURPOSE: To provide a manufacturing method of a semiconductor device having an improved narrow-pitch and multi-pin structure which realizes a high-reliability wire bonding quality. CONSTITUTION: An adhesive agent 6 coating a protective sheet 7 is laid on the lower face of a tip part 5 of an inner lead part 4 of a lead frame 1, the frame 1 and sheet 7 are pressed by a taping jig 11 from above and below enough to pressure-fit the adhesive agent 6 into the gap at the tip part 5 and harden it, the sheet 7 us peeled off, the tip part 5 is fixed, and a semiconductor chip 3 is mounted on a die pad 2 and connected to this part 5 by a bonding wire 8. This avoids absorbing and dispersing the ultrasonic energy at wire bonding and hence stabilize the wire bonding quality.