发明名称 TAKING-IN DEVICE FOR WIRE BUNDLE ASSEMBLY
摘要 PURPOSE: To automatically take in a wire bundle assembly automatically produced by a producing equipment, and arrange it into a required form. CONSTITUTION: This device has a device 8 for bundling a wire bundle assembly received from a producing equipment 1. It also has a device 9 for carrying the wire bundle assembly bundled by the device 8 as it is, and also a device 200 for correcting the wire bundle assembly to a form facilitating an aftertreatment such as taping. The wire bundle assembly can be thus received from the producing equipment 1 and arranged into a required form. Accordingly, its stock and aftertreatment are facilitated.
申请公布号 JPH08222048(A) 申请公布日期 1996.08.30
申请号 JP19950023073 申请日期 1995.02.10
申请人 SUMITOMO WIRING SYST LTD 发明人 TOMINAGA TOMOYA
分类号 H01R43/20;H01B13/00;H01B13/012 主分类号 H01R43/20
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