SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: To obtain a semiconductor device and manufacturing method thereof which allows the mounting area of a semiconductor element to be reduced. CONSTITUTION: This device comprises a circuit board 1, first electronic component 20 having electrodes 22 covered with a seal resin 23 and mounted on the circuit board 1, and second electronic component 41 disposed on the first element and mounted on the circuit board.