| 摘要 |
PURPOSE: To obtain large adhesive strength between an insulating layer and conductor layer by exposing part of copper particles on the surface of the insulating layer by removing the surface layer of the insulating layer after fixing the particles scattered on the surface of the insulating layer by pressing down the particles and forming a conductor circuit by plating the surface of the insulating layer on which part of the particles is exposed. CONSTITUTION: A conductor circuit 2a is formed by etching the copper which is the base material for a copper-plated laminated substrate 1 and an insulating layer 3 is formed on the surface of the substrate 1. Then copper particles 4 are spread on the surface of the layer 3 and buried in the layer 3 by pressing down the particles 4 and part of the particles 4 is exposed on the surface of the layer 3 by polishing the surface of the layer 3. In addition, a second conductor circuit 6a is formed by forming via holes 5 and plated conductor layers on the surface of the layer 3 and internal surfaces of the holes 5, and then, etching the conductor layer in a second pattern. Moreover, a third conductor circuit 9a is formed by opening a through hole 8 and forming a plated conductor layer on the internal surface of the hole 8 and the surface of an insulating layer 7, and then, etching the conductor layer 7 in a third pattern. |
