| 发明名称 |
CHIP-TYPE ELECTRONIC COMPONENT AND ITS MANUFACTURE |
| 摘要 |
<p>PURPOSE: To easily thin a surface mounting type electronic component and to realize stable quality and easy manufacturing. CONSTITUTION: At least one pair of electrodes 16 consisting of a metallic thin film are formed in an end part on an insulating resin film 12. A metallic thin film which is a resistor 18 and a dielectric such as barium titanate are formed as an electronic element between the electrodes 16. The electrode 16 is formed in a surface of the resin film 12 through a ceramic thin film 14.</p> |
| 申请公布号 |
JPH08222405(A) |
申请公布日期 |
1996.08.30 |
| 申请号 |
JP19950046404 |
申请日期 |
1995.02.10 |
| 申请人 |
HOKURIKU ELECTRIC IND CO LTD |
发明人 |
AZUMA KOJI;ISHIYAMA ICHIRO;KUROKAWA HIROYUKI;NAGARE ICHIRO;OBARA YOZO |
| 分类号 |
H01G4/12;H01C1/14;H01C7/00;H01C17/06;H01C17/28;(IPC1-7):H01C7/00 |
主分类号 |
H01G4/12 |
| 代理机构 |
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代理人 |
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