| 摘要 |
PURPOSE: To obtain a lead frame in which resin flashes can be removed easily and a method for manufacturing a resin sealed semiconductor device enploying it. CONSTITUTION: The lead frame 1 comprises islands 2 for mounting semiconductor elements, leads 4 partially sealed with mold resin, and dam bars 14 coupling the leads formed by punching a thin plate of iron-nickel alloy (42 alloy) or copper alloy and subjecting to chemical, treatment wherein a part of the island 2 and the lead 4, i.e., the region to be sealed with a transparent resin, is temporarily subjected to Ag plating. Flashes can be removed easily from the unplated region exhibiting low adhesion by taking advantage of the difference of adhesion between the lead frame and the transparent mold resin. In the plated region exhibiting high adhesion, the island and lead adhere more rigidly to the transparent mold resin thus suppressing package crack or removal of lead. |
