| 摘要 |
PURPOSE: To provide a method of mounting electronic components that are connected reliably and are not influenced by the deviation of the height of bumps when bumps are formed with metallic wire. CONSTITUTION: Bumps 3 are formed with metal wire on the terminal 2 of an electronic component 1 and conductive binder 5 such as creamy solder is transferred to the bumps 3. Recessed bezels 6 that mate the bumps 3 are formed on a printed wiring board 4. The electronic component 1 is mounted on the printed wiring board 4 after aligning the position by a mechanical or an optical method. Then the mounting is completed by setting the conductive binder 5 by melt-setting or thermosetting. When a short bump 35 is mounted so that it contacts the recessed bezel 6 on the printed wiring board 4, a tall bump 34 is inserted in the bezel 6 of the printed wiring board 4. Therefore, without correcting the variation of the height of the bumps formed on the electronic components by, e.g. flattening, these are reliably connected to the pads on the printed wiring board. |
