| 摘要 |
PURPOSE:To improve a mounting density by electrically connecting die pads and bonding pads to predetermined regions of a wiring substrate to form a plurality of them, covering the pad faces with an Au-plated layer, then selectively removing the predetermined region of the substrate, and isolating the pads. CONSTITUTION:A plurality of fine wiring patterns such as die pads 1, bonding pads 2 made of Cu or Al formed on predetermined regions of a wiring substrate 5 are electrically connected to each other, an electrolytic Au-plated layer is formed on the faces of the pads 1 via one plating conductor terminal, the patterns are then cut to electrically independently isolate the pads 1, 2 from each other. Thus, the number of the terminals (plated lines) is reduced, occupied area by the substrate is decreased, the mounting area can be reversely increased to improve a mounting density. |
