发明名称 PROCESSING METHOD FOR PROTECTING PROTECTED CONDUCTIVE FOIL AND ELECTR- -ODEPOSITED METALLIC FOIL IN PROCESSING
摘要 PURPOSE: To protect a foil from damage, in foil handling followed by manufacture of printed circuit substrates, by providing a conductive metal foil comprising two surfaces and a plastic film layer which, while covering one surface of the foil in overlapped manner for protection, keeps separation from the foil. CONSTITUTION: A foil 20 is a conductive copper foil which is electrocoated and double processed. The film of the conductive metal foil material 20 is drawn out of a roll 22, and the film of a plastic film material 24 drawn out of a roll 26. The foil film 20 drawn out of the roll 22 and the plastic film 24 drawn out of the roll 26 are combined at a point 28, with an assembly, inserted in between, taken up with a roll 30 for housing. At that time, a series of spots 36 are adapted to ech side of inserted materials, with the foil 20 and the plastic film layer 24 combined while separation is possible (release is possible) at its facing edge. The plastic layer 24 is easily removed from the metal foil layer 20 by removing a joint part 32.
申请公布号 JPH02307296(A) 申请公布日期 1990.12.20
申请号 JP19900117309 申请日期 1990.05.07
申请人 GOULD INC 发明人 ROORANDO DEII SABIIJI;JIYON PIII KARAHAN
分类号 H05K3/28;B32B7/06;B32B15/08;H05K3/02;H05K3/06;H05K3/46 主分类号 H05K3/28
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