发明名称 Multi-chamber cathode sputtering appts.
摘要 The appts. comprises vacuum chambers (3,4) with target electrodes (12a,12b,12c,12d), a transfer chamber (2) and an automatic transfer unit (7) for moving a substrate (18) from one chamber into another without breaking the vacuum. At least one of the chambers has target electrodes and a substrate moving mechanism (16) which allows the substrate to be positioned opposite to one of the target electrodes, and enables the distance between the substrate and the electrodes to be altered.
申请公布号 DE19606463(A1) 申请公布日期 1996.08.29
申请号 DE19961006463 申请日期 1996.02.21
申请人 HITACHI, LTD., TOKIO/TOKYO, JP 发明人 KAMEI, MITSUHIRO, TAKAHAGI, IBARAKI, JP;SETOYAMA, EIJI, HITACHI, IBARAKI, JP;UMEHARA, SATOSHI, HITACHIOOTA, IBARAKI, JP
分类号 C23C14/56;H01L21/00;(IPC1-7):C23C14/22;H01J37/34 主分类号 C23C14/56
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