发明名称 |
METHOD FOR MAKING A HEAT CONDUCTION-COOLED ELECTRONIC CARD |
摘要 |
<p>Methods for making thermally cooled electronic cards are disclosed. The method comprises providing a card (2, 3i) of any kind to be covered with a rigid heat sink (1) shaped to fit and attached to the card (2, 3i), and forming said heat sink (1) in such a way that it fits as closely as possible the shape of the printed circuit (2) having components (3i) on one or both sides thereof, whereby the surface thermal coupling between the sink (1) and the card (2, 3i) may be increased, by means of an optical sensor which preferably operates with a laser beam. Such a heat sink may thus be manufactured more quickly.</p> |
申请公布号 |
WO9626631(A1) |
申请公布日期 |
1996.08.29 |
申请号 |
WO1996FR00150 |
申请日期 |
1996.01.30 |
申请人 |
THOMSON-CSF;SUPPA, VITO;BEGNIS, NOEL;ALDON, JEAN-CLAUDE |
发明人 |
SUPPA, VITO;BEGNIS, NOEL;ALDON, JEAN-CLAUDE |
分类号 |
G05B19/42;H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
G05B19/42 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|