Printed circuit board with mfg. method

摘要

The board carries a conductive layer (3) formed on a bonding layer (2) which covers the entire surface. The radius of curvature of the surface of the bonding layer in the vicinity of the edge (1a) is greater than that of the surface of the board itself in that region. Deposition of the bonding layer is followed by application of a plating catalyst and formation of a plating resist on the surface except in areas where the circuit is to be printed. The circuit pattern is produced by electroless or electrolytic plating and the resist is removed.