| 摘要 |
<p>The present invention relates to a process for the microencapsulation of a water-insoluble adhesive in envelopes of polymeric material, which comprises preparing an aqueous solution with a polymeric emulsifying agent having hydroxyl groups and containing a second component of the envelope, emulsifying the aqueous solution with a water-immiscible adhesive containing a non-polymeric or prepolymeric cross-linking agent which constitutes a first component of the envelope, and effecting a polycondensation reaction to obtain a polymeric wall which constitutes the envelope encapsulating the adhesive.</p> |
