发明名称 Semiconductor device having multilayer wiring and the method of making it.
摘要 <p>A semiconductor device having multilayer wiring for providing power and control signals to elements of said device comprising, a first wiring element (14, 15) for supplying power to a plurality of elements of the semiconductor device, a second wiring element (11, 12, 13) made of a first material for carrying direct current or pulsed direct current to at least one element of said semiconductor device, and a third wiring element (16) made of a second material for carrying bidirectional signals to at least one element of said semiconductor device, wherein the resistance to electromigration of the first material is higher than the resistance to electromigration of the second material. <IMAGE> <IMAGE></p>
申请公布号 EP0574097(A2) 申请公布日期 1993.12.15
申请号 EP19930202460 申请日期 1990.03.14
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 NOGUCHI, TATSUO;YOSHIDA, MASAYUKI;HATANAKA, KAZUHISA;TANAKA, SHIGERU
分类号 H01L23/522;H01L23/528;H01L23/532;H01L27/092;H01L29/45;(IPC1-7):H01L23/522;H01L23/50 主分类号 H01L23/522
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