LEAD FRAME, MANUFACTURE THEREOF, AND MANUFACTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: To enhance the tips of outer leads in solder wettability and to enable solder to adhere to them by a method wherein a frame and a lead section separate from each other are fixed together with the tips of the outer leads. CONSTITUTION: A lead frame is composed of a frame 8 and a lead section 7 separate from each other, where the frame 8 and the lead section 7 are fixed together at the tips of outer leads 3b of leads 3 or the periphery of the lead frame is defined by the frame 8, and the lead section 7 is provided inside the frame 8. The tip faces of the outer leads 3b are exposed when the outer leads 3b are subjected to surface treatment, and a gap is provided between the frame 8 and the tip faces of the outer leads 3b. Therefore, the tip faces are coated with a surface treatment material 10, so that they are hardly deteriorated in solder wettability, and solder is attached enough to the tips of the outer leads 3b.