MULTILAYER CERAMIC BOARD

摘要

PURPOSE: To obtain a multilayer ceramic board to be mounted in BGA type in which the bonding strength is enhanced between the electrode pad and the board so that the board can withstand thermal hysteresis sufficiently. CONSTITUTION: A recess is made at a position for forming an electrode pad 3 in the outermost layer of a multilayer ceramic board 2. The electrode pad 3 is formed while filling the recess and covering the upper part thereof and the periphery thereof.