MANUFACTURE OF THREE-DIMENSIONAL INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide the method of producing three dimensional integrated circuits with which yield is improved and manufacturing cost is reduced. SOLUTION: A first and a second component base layers 1 and 7 with which two processes are completed are combined. The second component base layer 7 is functionally tested in advance and perfect chips having the functional performance of the second component layer 7 are selected by the function test. Then, the second component base layer 7 is sliced thinner from the backside and separated to each of chips. Then, only the selected complete chips having the functional performance are arranged on the first component base layer 1 with an adhesive layer on it, adjusted and pasted on it.