| 摘要 |
PURPOSE: To provide a mounting structure in which a semiconductor element is directly connected to a circuit board wiring by bump. CONSTITUTION: The semiconductor device comprises a semiconductor chip 1 provided with a first bump 8 on its electrode pad 2, a wiring circuit board 5 provided at a second bump 9 connected to the bump 8 on the chip 1 on a board wiring 6, and sealing resin 7 filled in the gap between the chip 1 and the board 5, wherein the bumps 8, 9 are connected in contact between the chip 1 and the board 5 at a high bump 10. According to the structure, adhesive is eliminated, the chip 1 can be connected to the board, and the connecting structure of the element 1 to the board 6 corresponding to a thermal stress can be realized. |
