| 摘要 |
In a wafer process of a semiconductor device, disclosed are photomasks and a semiconductor device producing method. In forming a plurality of semiconductor chips on a semiconductor substrate by using a plurality of photomasks, at least one photomask 10 having an effective chip arrangement composed of a grid-like pattern 80 which does not form chips incomplete in appearance and/or in function in an outer circumferential range of a wafer 3 is used in the exposure step.
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