Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer

摘要

A micro consideration of the phase change or boiling cooling of an electronic part is disclosed including focus on a heat exchanging problem that is encountered in the use of this phase change cooling in the presence of realistic flow rates and energy dissipations. The combination of coolant flow and projection of the cooled part into the coolant stream flow is shown to result in difficulties that make such cooling less desirable for electronic and other purposes without use of improvement such as, is achieved in the present invention. Preclusion of these difficulties (involving coolant vapor) by the addition of a small geometric shape or other vapor-considered alterations of the cooled part environment are also disclosed. Results of the achieved improved cooling are shown in graphic relationships. The disclosed invention is couched in terms of electronic part cooling but is applicable to a variety of other heat exchange situations.