发明名称 |
Capped copper electrical interconnects |
摘要 |
The present invention relates generally to a new structure and method for capped copper electrical interconnects. More particularly, the invention encompasses a novel structure in which one or more of the copper electrical interconnects within a semiconductor substrate are capped to obtain a robust electrical interconnect structure. A method for obtaining such capped copper electrical interconnect structure is also disclosed. These capped interconnects can be a single layer or multi-layer structures. Similarly, the interconnect structure that is being capped can itself be composed of single or multi-layered material.
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申请公布号 |
US5545927(A) |
申请公布日期 |
1996.08.13 |
申请号 |
US19950440414 |
申请日期 |
1995.05.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FAROOQ, MUKTA S.;KAJA, SURYANARAYANA;PERFECTO, ERIC D.;WHITE, GEORGE E. |
分类号 |
H01L23/498;H01L23/532;H05K1/03;H05K3/06;H05K3/10;H05K3/38;H05K3/46;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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