| 摘要 |
The insulating layers are formed from ortho-silicate or substitute from beryllium, magnesium, calcium, strontium, barium and/or titanium and the (pref.) electro-ceramic material titanium doped Perovskite based on barium titanate (BaTiO3) that builds eutectic systems and does not react chemically with the ortho-silicate. An integrated electronic module is formed from layers of the ceramic material, the passive elements and the insulating ortho-silicate into a green or raw form prior to drying and sintering between 1000 and 1400 degrees C. Example mfg. methods for prodn. of the insulating material, construction of a module and sintering are given. An electronic component packing density of ≤ 150 per sq.cm is attainable. |
