发明名称 WIRING BOARD
摘要 PURPOSE: To obtain a wiring board easy and cheap to be manufactured and moreover having little danger of causing a crack to solder and allowing to resist thermal stress. CONSTITUTION: In a wiring board where wiring of a conductive material 3 is laid on a wiring board 1 having a lead wire insertion hole 2, a lead wire 4a of the electric parts 4 inserted into the lead wire insertion hole 2 of the wiring board 1 is fixed to the wiring board 1 by solder 5, further, the lead wire 4a is made to be connected to the conductive material 3 through solder 5, the conductive material 5 is provided ranging from the side of a wiring surface 1a of the wiring board 1 to the halfway part of the inside surface of the lead wire insetion hole 2.
申请公布号 JPH08204297(A) 申请公布日期 1996.08.09
申请号 JP19950007537 申请日期 1995.01.20
申请人 IKEDA ELECTRIC CO LTD 发明人 NAKAMURA TAKAHIRO
分类号 H05K3/34;H05K1/02;H05K1/18;H05K3/40;(IPC1-7):H05K1/02 主分类号 H05K3/34
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