| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer holder capable of uniformly polishing the whole surface of a wafer, because a usual wafer holder has a problem of tendency wherein material is polished and removed at higher rates not from the center of a wafer but from the periphery, in a semiconductor wafer polishing machine. SOLUTION: A wafer polishing equipment 10 is provided with a polishing pad assembler 12 having a polishing pad belt 14 and a belt platen 16, and a wafer holder 18 which holds a wafer in the state positioned by pressing the surface to be polished of a wafer W against the polishing pad belt. The wafer holder 18 is provided with a Cardan joint having two rotating shaft lines which intersect at the rotation center position. A wafer chuck is so formed that a wafer is retained on only the outer periphery by an inner ring. The wafer chuck is linked with the joint in the linkage region which is arranged adjacently to not the center but the periphery, large pressure is applied to the center of the chuck by the joint, and the higher material removal rates can be obtained not in the peripheral part but in the central part of a wafer. |
