ELECTRICALLY CONDUCTIVE ADHESIVE BONDLINES

摘要

An improved method and composition is provided for the preparation of electrically conductive bondlines for composite structures while retaining the desirable physical strength properties for an effective composite bondline. The bondlines are formed through use of an expanded metal foil filled with a non-conductive composite adhesive, the latter selected from a group consisting of thermosetting and thermoplastic adhesive polymers. The improved bondlines provide electrical resistivity less than 0.05 OMEGA .cm and bond strength in excess of 3000 psi. The expanded metal foils are selected from a group consisting of nickel and stainless steel.