发明名称 Thin film multi-layer oxygen diffusion barrier consisting of aluminum on refractory metal
摘要 <p>The use of a bi-layer thin film structure consisting of aluminum or aluminide on a refractory metal layer as a diffusion barrier to oxygen penetration at high temperatures for preventing the electrical and mechanical degradation of the refractory metal for use in applications such as a capacitor electrode for high dielectric constant materials. <IMAGE></p>
申请公布号 EP0725428(A2) 申请公布日期 1996.08.07
申请号 EP19950120466 申请日期 1995.12.22
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CABRAL, CYRIL, JR.;COLGAN, EVAN GEORGE;GRILL, ALFRED
分类号 H01L27/04;H01L21/02;H01L21/027;H01L21/28;H01L21/3205;H01L21/768;H01L21/822;H01L21/8242;H01L23/52;H01L23/532;H01L27/108;(IPC1-7):H01L21/285;H01L21/320;H01L23/485 主分类号 H01L27/04
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