发明名称 |
Compositions for protecting semiconductor elements and semiconductor devices |
摘要 |
Curable silicone compositions comprise either (a) microparticles of a fluororesin, which exhibits low adhesion to the cured composition, or (b) microparticles of an organic or inorganic material whose surfaces have been coated with this type of fluororesin. The compositions are useful coatings for semiconductor devices requiring high levels of moisture- and heat-resistance. <IMAGE> |
申请公布号 |
EP0686669(A3) |
申请公布日期 |
1996.08.07 |
申请号 |
EP19950108670 |
申请日期 |
1995.06.06 |
申请人 |
DOW CORNING TORAY SILICONE COMPANY, LIMITED |
发明人 |
MINE,KATSUTOSHI;NAITO,HIROYOSHI;YAMAKAWA, KIMIO |
分类号 |
C08K9/04;C08K9/10;C08L27/12;C08L83/04;C08L87/00;H01L23/29;H01L23/31 |
主分类号 |
C08K9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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