| 摘要 |
A wafer polishing apparatus has a wafer chuck for holding a wafer with a surface to be polished directed upward, the wafer chuck being rotatable by a wafer chuck rotation motor; a pair of nozzles for supplying slurries used as polishing solutions to the wafer; and a polishing head for holding a polishing cloth pad which is smaller in diameter than the wafer. The polishing head is rotated in the same direction as the wafer chuck by a polishing head rotation motor and is also reciprocally moved along the surface of the wafer to be polished by an arm driving motor. The wafer polishing apparatus also has a polishing head load adjusting air cylinder for pressing the polishing cloth pad against the wafer by way of the polishing head. |
