| 摘要 |
PURPOSE: To obtain a copper paste, consisting essentially of a dendritic copper powder and a thermosetting resin, capable of providing the extracted copper powder having a specific particle diameter and a specified density and affording a cured product excellent in electric conductivity and reliability for a long period, especially moisture resistance by thermosetting. CONSTITUTION: This copper paste is obtained by kneading a dendritic copper powder having the surface treated with a titanium coupling agent with a thermosetting resin consisting essentially of an epoxy resin using a blade type kneader such as a planetary mixer. Thereby, the resultant copper paste provides the extracted copper powder having 2-20μm average particle diameter and <=3.3g/cm<3> tap density.
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