| 发明名称 |
Polishing apparatus and method for planarizing layer on a semiconductor wafer |
| 摘要 |
Reproducible polishing of semiconductor wafers and devices is obtained by adapting the polishing conditions in accordance with the ratio between an initial detected friction value and a friction value detected after a predetermined period of time. |
| 申请公布号 |
GB9611104(D0) |
申请公布日期 |
1996.07.31 |
| 申请号 |
GB19960011104 |
申请日期 |
1993.05.26 |
| 申请人 |
TOSHIBA, KABUSHIKI KAISHA |
发明人 |
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| 分类号 |
B24B37/04;B24B49/00;B24B49/02;B24B49/04;B24B49/16;C09K3/14;H01L21/3105;H01L21/66 |
主分类号 |
B24B37/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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