发明名称 COOLING SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a cooling system enabling to efficiently dissipate heat without damaging a high frequency property or the like by absorbing deformation of a heating generating unit caused when built in. SOLUTION: The cooling system comprises a heat generating unit 1, a heat sink 3 which dissipates heat from the unit 1 and a heat dissipation sheet 2 inserted between the unit 1 and the heat sink 3. The heat dissipation sheet 2 has electric conductivity and thermal conductivity and is formed of a soft material which gradually changes it thickness at least on one side of both front and back sides.
申请公布号 JP2002164483(A) 申请公布日期 2002.06.07
申请号 JP20000361864 申请日期 2000.11.28
申请人 NEC CORP 发明人 ISHIDA MASATOSHI
分类号 H05K7/20;H01L23/36;(IPC1-7):H01L23/36 主分类号 H05K7/20
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