THIN FILM CHIP CAPACITOR IN INTEGRATED CIRCUIT AND ITS PREPARATION

摘要

PROBLEM TO BE SOLVED: To obtain a thin film chip capacitor provided with a short bonding wire in order to reduce noise in which the arrangement of standard chip bonding pad can be used for the bonding pad of predetermined size and the size of capacitor can be increased as compared with a conventional integrated circuit in order to reduce noise furthermore. SOLUTION: An integrated circuit chip 32 and a flat capacitor 34 are coupled through a short bonding wire 50 in order to reduce noise. The flat chip capacitor 34 is coupled to the chip 32 and includes first and second electrodes 38, 40 and a dielectric layer 42 interposed between them. The earth and the power bonding pads 36a of the integrated circuit chip 32 are connected with a plurality of terminals 44 arranged in a row in the vicinity of the outer fringe of the capacitor 34. The terminals 46 of the capacitor 34 are coupled to the plurality of package leads of a lead frame or other integrated circuit package.