Semiconductor device

摘要

Disclosed is a semiconductor device having a semiconductor power module mounted on a circuit board (2) comprising an insulating ceramic plate. The ceramic plate 2a is fabricated by sintering at high temperature an alumina powder compact containing zirconia and either one of the additives yttria, calcia, magnesia, and ceria. The flexural strength and the thermal conductivity of this ceramic plate of the invention are remarkably improved compared to one made from only alumina. The thickness of the ceramic plate can, thus, be reduced. The circuit board quickly radiates heat generated in the semiconductor device.