发明名称 METHOD AND EQUIPMENT FOR WIRE BONDING
摘要 PURPOSE: To stabilize the form of a wire loop, and prevent the generation of unnecessary stress on a bonding point, by oscillating a vibrator at a frequency equal to the resonance frequency at the time of bonding to a first bonding point, when a capillary moves. CONSTITUTION: An ultrasonic oscillation equipment 15 has a storage part 29. The oscillation frequency generated from a voltage-controlled oscillator 27 at the time of bonding to a first bonding point is stored in the storage part 29. At the time of loop formation when a capillary 19 moves from a first bonding point to a second bonding point, the PLL (phase locked loop) control is not performed but the driving power at the frequency stored in the storage part 29 which is equal to the resonance frequency of a bonding arm 12 is applied to a vibrator 25.
申请公布号 JPH08191087(A) 申请公布日期 1996.07.23
申请号 JP19950017454 申请日期 1995.01.10
申请人 TOSHIBA SEIKI KK 发明人 UEMURA SATORU
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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