| 摘要 |
The present disclosure provides a method for manufacturing an interconnect in a semiconductor device, a method for manufacturing a digital micromirror device, a digital micromirror device and a method for manufacturing a projection display system. The method for manufacturing the digital micromirror device, without limitation, may include forming a first metal layer over a substrate and subjecting the first metal layer to an immersion deposition process, the immersion deposition process forming a passivating layer over the first metal layer. This method may also include forming a spacer layer over the first metal layer, the spacer layer having one or more openings therein, and forming a second metal layer over the spacer layer and in the one or more openings, the second metal layer contacting the passivating layer.
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