| 摘要 |
<p>A method of removing particles adherent to substrates, in particular, silicon wafer substrates by cleaning with an ammonia-hydrogen peroxide solution mixture, rinsing with ultrapure water, cleaning with hydrofluoric acid, and rinsing with ultrapure water, wherein an anionic surfactant is added to the hydrofluoric acid and, if necessary, to the ammonia-hydrogen peroxide solution mixture. As the particles detached in the step of cleaning with an ammonia-hydrogen peroxide solution mixture are not absorbed again in the step of cleaning with hydrofluoric acid, the particle removal rate is remarkably improved.</p> |
