发明名称 ELECTRONIC COMPONENT PACKAGING DEVICE
摘要 PURPOSE: To provide an electronic components packaging device coping with various sizes of electronic components without increasing the entire size of a background plate. CONSTITUTION: A plurality of background plates 20 and 21 for reflecting light are provided at the rear of a nozzle 6 and a switching means for bringing the background plates 20 and 21 closer to or away from the nozzle 6 and a control part for controlling the switching means by referring to the size of the electronic components currently sucked by the nozzle 6.
申请公布号 JPH08186397(A) 申请公布日期 1996.07.16
申请号 JP19950000251 申请日期 1995.01.05
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 FUJISHIRO KEISUKE;TAKADA KOJI
分类号 B23P21/00;H05K13/04;H05K13/08 主分类号 B23P21/00
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