发明名称 |
ELECTRONIC COMPONENT PACKAGING DEVICE |
摘要 |
PURPOSE: To provide an electronic components packaging device coping with various sizes of electronic components without increasing the entire size of a background plate. CONSTITUTION: A plurality of background plates 20 and 21 for reflecting light are provided at the rear of a nozzle 6 and a switching means for bringing the background plates 20 and 21 closer to or away from the nozzle 6 and a control part for controlling the switching means by referring to the size of the electronic components currently sucked by the nozzle 6. |
申请公布号 |
JPH08186397(A) |
申请公布日期 |
1996.07.16 |
申请号 |
JP19950000251 |
申请日期 |
1995.01.05 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
FUJISHIRO KEISUKE;TAKADA KOJI |
分类号 |
B23P21/00;H05K13/04;H05K13/08 |
主分类号 |
B23P21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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