| 摘要 |
<p>PURPOSE: To provide a manufacturing method of an easily manufacturable noncontact type IC card with improved durability against the deformation of the card. CONSTITUTION: At the time of manufacturing the noncontact IC card with a built-in data carrier circuit (referred to as an 'IC circuit' hereafter) for which IC component and antenna coil component are connected, by using the hardenable resin of an amount expressed by a formula, the sealing of the IC circuit to the recessed part of a base material sheet made of synthetic resin and the lamination of a film made of the synthetic resin onto the surface of the base material sheet are performed. It is defined as 5>=V3 /(V1 -V2 +α.s.t)>=1 where V1 is the volume of the recessed part 3, V2 is the volume of the IC circuit 2, V3 is the volume of the hardenable resin 6 to be used,αis the real number of 1 to 10, (s) is the area of the upper surface part of the IC card and (t) is the thickness of an adhesion layer 8.</p> |
