发明名称 MULTILAYER PRINTED WIRING BOARD AND MANUFACTURE THEREOF
摘要 PURPOSE: To enable a multilayer printed wiring board to be markedly lessened in energy consumption used for manufacture and improved in registration. CONSTITUTION: An electric insulating layer 3 of a multilayer printed board main body 1 is composed of a photosetting resin layer 4, a light transmitting electric insulating layer 5, and another photosetting resin layer 4. The light transmitting electric layer 5 is provided between the photosetting resin layers 4 and 4 and made of glass fibers or quartz fibers. When light is guided into the multilayer printed board main body 1 through the light transmitting electric insulating layer 5, the photosetting resin layers 4 and 4 are set by the light, whereby the layers 2 and 3 are formed into one piece.
申请公布号 JPH08186342(A) 申请公布日期 1996.07.16
申请号 JP19950244614 申请日期 1995.09.22
申请人 HITACHI CHEM CO LTD 发明人 KAWAZOE HIROSHI;MINAGAWA KAZUYASU;IWASAKI YORIO
分类号 B32B17/04;H05K1/03;H05K3/46;(IPC1-7):H05K1/03 主分类号 B32B17/04
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