| 摘要 |
PURPOSE: To provide a surface mount semiconductor device which can be positioned precisely when it is mounted in the vertical direction (as viewed from the top) and the horizontal direction (as viewed from the side) with reference to an external mounting board and can be mounted stably without being tilted when it is mounted in the horizontal direction (as viewed from the side). CONSTITUTION: When a surface mount semiconductor device is to be mounted in the horizontal direction (as viewed from the top) with reference to an external mounting board 3, the side face of a light transmitting resin body 8 and the side face of an insulating block body 1 are set on the same face so as to be capable of sufficiently standing by itself. In addition, coupling pieces 4, 4' are formed on the side face and the bottom face of the insulating block body 1 so as to be capable of being positioned precisely.
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